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Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].

Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter...

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Bibliographic Details
Main Author: Abdullah, Muhammad Khalil
Format: Thesis
Language:English
Published: 2006
Subjects:
TK7885-7895 Computer engineering. Computer hardware
Online Access:http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf
http://eprints.usm.my/9178/
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spelling my.usm.eprints.9178 http://eprints.usm.my/9178/ Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. Abdullah, Muhammad Khalil TK7885-7895 Computer engineering. Computer hardware Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options. 2006-06 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf Abdullah, Muhammad Khalil (2006) Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TK7885-7895 Computer engineering. Computer hardware
spellingShingle TK7885-7895 Computer engineering. Computer hardware
Abdullah, Muhammad Khalil
Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
description Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options.
format Thesis
author Abdullah, Muhammad Khalil
author_facet Abdullah, Muhammad Khalil
author_sort Abdullah, Muhammad Khalil
title Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_short Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_full Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_fullStr Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_full_unstemmed Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_sort modelling and analysis of stacked-chip scale packages (s-csps) encapsulation process using finite difference method [tk7874. k46 2007 f rb].
publishDate 2006
url http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf
http://eprints.usm.my/9178/
_version_ 1643701197194919936
score 13.160551

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