FEM Simulation on Stencil Bending Due to Squeegee Load during Solder Paste Stencil Printing Process
In the assembly of the printed circuit board, the squeegee moves in one direction with the application of load on the squeegee. This will result from the squeegee deflect the stencil and Printed Circuit Board (PCB) throughout the stencil printing process. This loading creates micro-bending on the st...
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| Main Author: | |
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2021
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| Online Access: | http://eprints.usm.my/55966/1/FEM%20Simulation%20on%20Stencil%20Bending%20Due%20to%20Squeegee%20Load%20during%20Solder%20Paste%20Stencil%20Printing%20Process.pdf http://eprints.usm.my/55966/ |
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