Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf http://eprints.usm.my/42392/ |
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