Nanoindentation Of Copper Thin Film On Silicon Substrates
In this day, metallization has shifted to copper because of its high electrical and thermal conductivity, greater melting temperature, and lower rate of diffusivity compared to other metals. In this study, nanoindentation method is used to examine the mechanical characteristics of thin copper film w...
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| Main Author: | |
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2022
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| Subjects: | |
| Online Access: | http://eprints.usm.my/55869/1/Nanoindentation%20Of%20Copper%20Thin%20Film%20On%20Silicon%20Substrates_Muhammad%20Amir%20Zalkapli.pdf http://eprints.usm.my/55869/ |
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