Nanoscale microstructural characterization of aluminum and copper bilayer thin films deposited on silicon substrate using magnetron sputtering technique

• Main Author: Abdul Halim, Zulhelmi Alif
• Format: Thesis
• Language: English
• Published: 2014
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/50821/25/ZulhelmiAlifAbdulHalimMFKM2014.pdf; http://eprints.utm.my/id/eprint/50821/; http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:85436

Aluminum and copper (Al-Cu) bilayer thin films are commonly used as conductors in electronic applications. Unfortunately, the effect of thermal aging on the interfaces of Al-Cu bilayer thin films have led to the formation of intermetallic compounds (IMCs) which eventually degrades the materials. The...