Nanoscale microstructural characterization of aluminum and copper bilayer thin films deposited on silicon substrate using magnetron sputtering technique

Aluminum and copper (Al-Cu) bilayer thin films are commonly used as conductors in electronic applications. Unfortunately, the effect of thermal aging on the interfaces of Al-Cu bilayer thin films have led to the formation of intermetallic compounds (IMCs) which eventually degrades the materials. The...

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Bibliographic Details
Main Author: Abdul Halim, Zulhelmi Alif
Format: Thesis
Language:English
Published: 2014
Subjects:
Online Access:http://eprints.utm.my/id/eprint/50821/25/ZulhelmiAlifAbdulHalimMFKM2014.pdf
http://eprints.utm.my/id/eprint/50821/
http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:85436
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