Alternative double pass dicing method for thin wafer laminated with die attach film
This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100pm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this pr...
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| Main Authors: | , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5325 |
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