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Alternative double pass dicing method for thin wafer laminated with die attach film

This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100pm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this pr...

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Main Authors: Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5325
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spelling my.uniten.dspace-53252017-11-15T02:57:32Z Alternative double pass dicing method for thin wafer laminated with die attach film Jiun, H.H. Ahmad, I. Jalar, A. Omar, G. This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100pm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this problem, an alternative method of double pass saw process was proposed to reduce the blade loading. A set of experiments was carried outto determine the saw depth of the first and second pass. Chipping and cracks were characterized using measuring scope and observed with scanning electron microscopy (SEM). Results have shown that the method is more effective and able to reduce almost 80% of the chip/lateral crack as compared to single pass process. © 2004 IEEE. 2017-11-15T02:57:32Z 2017-11-15T02:57:32Z 2004 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5325
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100pm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this problem, an alternative method of double pass saw process was proposed to reduce the blade loading. A set of experiments was carried outto determine the saw depth of the first and second pass. Chipping and cracks were characterized using measuring scope and observed with scanning electron microscopy (SEM). Results have shown that the method is more effective and able to reduce almost 80% of the chip/lateral crack as compared to single pass process. © 2004 IEEE.
format
author Jiun, H.H.
Ahmad, I.
Jalar, A.
Omar, G.
spellingShingle Jiun, H.H.
Ahmad, I.
Jalar, A.
Omar, G.
Alternative double pass dicing method for thin wafer laminated with die attach film
author_facet Jiun, H.H.
Ahmad, I.
Jalar, A.
Omar, G.
author_sort Jiun, H.H.
title Alternative double pass dicing method for thin wafer laminated with die attach film
title_short Alternative double pass dicing method for thin wafer laminated with die attach film
title_full Alternative double pass dicing method for thin wafer laminated with die attach film
title_fullStr Alternative double pass dicing method for thin wafer laminated with die attach film
title_full_unstemmed Alternative double pass dicing method for thin wafer laminated with die attach film
title_sort alternative double pass dicing method for thin wafer laminated with die attach film
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5325
_version_ 1644493658014089216
score 13.160551

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