Effect of wafer thinning methods towards fracture strength and topography of silicon die

This paper characterizes die damage resulting from various wafer thinning processes. Die fracture strength is measured using ball breaker test with respect to die surface finish. Further study on surface roughness and topography of each surface finish is obtained by atomic force microscopy (AFM) and...

Full description

Saved in:
Bibliographic Details
Main Authors: Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Format:
Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5317
Tags: Add Tag
No Tags, Be the first to tag this record!