Correlation of silicon wafer strength to the surface morphology

• Main Authors: Omar, Ghazali, Tamaldin, Noreffendy, Muhamad, M. Rasat
• Format: Conference or Workshop Item
• Language: English
• Published: 2000
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utem.edu.my/id/eprint/5046/1/articleDetails.jsp%3Freload%3Dtrue%26arnumber%3D932453%26contentType%3DConference%2BPublications; http://eprints.utem.edu.my/id/eprint/5046/; http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber=932453&contentType=Conference+Publications

The trend in microelectronic packaging is towards thinner and smaller packages. To achieve this, the die must be smaller and thinner as well, which means greater susceptibility to process related failures, especially in the front-end processes. Silicon strength has been recognized as an important...