Characterization and optimizations of silicide thickness in 45nm pMOS device

• Main Authors: Salehuddin F., Ahmad I., Hamid F.A., Zaharim A.
• Other Authors: 36239165300
• Format: Conference Paper
• Published: 2023
• Subjects: 45nm pMOS; Cobalt salicide; Optimization; Taguchi method; Cobalt; Cobalt compounds; Polysilicon; Semiconductor devices; Semiconductor growth; Silicides; Taguchi methods; Thermoelectric equipment; Anneal temperatures; Experimental data; Gate electrode resistance; Halo implantation; International Technology Roadmap for Semiconductors; Optimum solution; Oxide growth; PMOS devices; Poly-si gates; Electron devices

The characteristics of high performance 45nm pMOS devices based on International Technology Roadmap for Semiconductor (ITRS) have been studied using ATHENA and ATLAS's simulator. There are four factors were varied for 3 levels to perform 9 experiments. The factors are halo implantation, Source/Drain (S/D) implantation, oxide growth temperature and silicide anneal temperature. In this paper, Taguchi Method was used to analyze the experimental data in order to get the optimum solutions for these factors. The silicide on the poly-Si gate electrode has been used to reduce the gate electrode resistance. The result shows that the threshold voltage (VTH) value is -0.1501 Volts. The value is exactly same with ITRS prediction. This shows that Taguchi Method is a very useful tool to predict the optimum solution in finding the 45nm pMOS fabrication recipes with appropriate VTH value. The result also shows that the average of silicide thickness after optimizations approaches is 30.12nm. �2010 IEEE.