Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

• Main Authors: Shi K.W., Yow K.Y., Lo C., Kar Y.B., Misran H.
• Other Authors: 35796107300
• Format: Conference Paper
• Published: Institute of Electrical and Electronics Engineers Inc. 2023

Ablation; Cost effectiveness; Dies; Industrial electronics; Ion beams; Laser ablation; Neodymium alloys; Neodymium lasers; Scanning electron microscopy; Semiconductor lasers; Silicon wafers; Yttrium aluminum garnet; Inspection tools; Laser frequency; Laser micro-machining; Laser process parameters;...