Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
This paper describes the development work on single and multi beam laser grooving technology for 40nm node low-k/ULK semiconductor device. A Nd:YAG ultraviolet (UV) laser diode operating at a wavelength of 355 nm was used in this study. The effects of single and multi beam laser micromachining param...
Saved in:
| Main Authors: | , , |
|---|---|
| 其他作者: | |
| 格式: | Conference Paper |
| 出版: |
Institute of Electrical and Electronics Engineers Inc.
2023
|
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|