In depth study of lead frame tape residuein quad flat non-leaded package
Purpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to...
Saved in:
| Main Authors: | , |
|---|---|
| 格式: | Article |
| 语言: | English |
| 出版: |
2020
|
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|