The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature
This paper presents current injection resemble single event upset (SEU) current at the vulnerable nodes on different configurations of C-elements under two different scenarios: process corner and temperature. The objectives are to identify the vulnerable nodes due to SEU and to find the critical cha...
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2015
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Online Access: | http://ir.unimas.my/id/eprint/13739/1/Norhuzaimin.pdf http://ir.unimas.my/id/eprint/13739/ http://www.jaspe.unimas.my/index.php/features/layouts?layout=edit&id=34 |
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my.unimas.ir.137392022-02-04T03:09:45Z http://ir.unimas.my/id/eprint/13739/ The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature Norhuzaimin, Julai TK Electrical engineering. Electronics Nuclear engineering This paper presents current injection resemble single event upset (SEU) current at the vulnerable nodes on different configurations of C-elements under two different scenarios: process corner and temperature. The objectives are to identify the vulnerable nodes due to SEU and to find the critical charges needed to flip the output from low to high (0-1) and high to low (1-0) on different configurations of C-elements. The comparisons of C-elements in term of the resistivity toward soft error are presented. JASPE 2015 Article PeerReviewed text en http://ir.unimas.my/id/eprint/13739/1/Norhuzaimin.pdf Norhuzaimin, Julai (2015) The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature. Journal of Applied Science & Process Engineering, 2 (2). pp. 83-96. ISSN 2289-7771 http://www.jaspe.unimas.my/index.php/features/layouts?layout=edit&id=34 |
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TK Electrical engineering. Electronics Nuclear engineering Norhuzaimin, Julai The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature |
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This paper presents current injection resemble single event upset (SEU) current at the vulnerable nodes on different configurations of C-elements under two different scenarios: process corner and temperature. The objectives are to identify the vulnerable nodes due to SEU and to find the critical charges needed to flip the output from low to high (0-1) and high to low (1-0) on different configurations of C-elements. The comparisons of C-elements in term of the resistivity toward soft error are presented. |
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Article |
author |
Norhuzaimin, Julai |
author_facet |
Norhuzaimin, Julai |
author_sort |
Norhuzaimin, Julai |
title |
The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature |
title_short |
The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature |
title_full |
The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature |
title_fullStr |
The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature |
title_full_unstemmed |
The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature |
title_sort |
impact of soft error on c-elements due to process corner variation and temperature |
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JASPE |
publishDate |
2015 |
url |
http://ir.unimas.my/id/eprint/13739/1/Norhuzaimin.pdf http://ir.unimas.my/id/eprint/13739/ http://www.jaspe.unimas.my/index.php/features/layouts?layout=edit&id=34 |
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1724078570964254720 |
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13.188404 |