Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
Master of Science in Materials Engineering
Saved in:
Main Author: | Norhayanti, Mohd Nasir |
---|---|
Other Authors: | Norainiza, Saud, Dr. |
Format: | Thesis |
Language: | English |
Published: |
Universiti Malaysia Perlis (UniMAP)
2017
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77984 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
by: Zawawi, Mahim
Published: (2018) -
Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
by: Muhammad Hafiz, Zan @ Hazizi
Published: (2016) -
Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
by: Nur Syahirah, Mohamad Zaini
Published: (2022) -
Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
by: Flora, Somidin
Published: (2019) -
Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
by: Nisrin, Adli
Published: (2017)