Description: Temperature cycling test for a Ball Grid Array (BGA) package using finite element analysis (FEA)

Master of Science (Microelectronic Engineering)

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Bibliographic Details
Main Author:	Muhammad Nubli, Zulkifli
Other Authors:	Prof. Dr. Zul Azhar Zahid Jamal
Format:	Thesis
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2019
Subjects:	Ball grid array (BGA) Ball grid array technology Finite element analysis (FEA) Reliability
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63441
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Description
Summary:	Master of Science (Microelectronic Engineering)