Copper-filled electrically conductive adhesives with enhanced shear strength
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Main Authors: | Ho, Li Ngee, Dr., Hiroshi, Nishikawa |
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Other Authors: | lnho@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
ASM International
2015
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299 |
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