Copper-filled electrically conductive adhesives with enhanced shear strength

Link to publisher's homepage at http://www.asminternational.org/

Saved in:
Bibliographic Details
Main Authors: Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors: lnho@unimap.edu.my
Format: Article
Language:English
Published: ASM International 2015
Subjects:
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299
Tags: Add Tag
No Tags, Be the first to tag this record!
Be the first to leave a comment!
You must be logged in first