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Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

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Bibliographic Details
Main Author: Tan, Chun Huat
Other Authors: Dr. Muhammad Iqbal Hussain
Format: Learning Object
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2014
Subjects:
Printed circuit board assembly (PCBA)
Manufacturing process
Ball grid array (BGA)
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
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spelling my.unimap-379122014-11-28T03:13:12Z Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component Tan, Chun Huat Dr. Muhammad Iqbal Hussain Printed circuit board assembly (PCBA) Manufacturing process Ball grid array (BGA) Access is limited to UniMAP community. The manufacturing of printed circuit board assembly (PCBA) is facing many problems especially in ball grid array (BGA) assembly. Therefore, it is important to focus on manufacturing process. Process improvement in this study is conducted in the company ‘S’ on the printed circuit board assembly (PCBA) production line. The objectives of the study is to collect and analyze data of selected printed circuit board assembly (PCBA) process parameters in order to reduce the number of defects of assembly process for plastic ball grid array (PBGA) component. There are four important variables in this study which is factor A-print speed, factor B-solder paste thickness, factor C-semi auto connecter jig force, and factor D-separation speed. Using design of experiment (DOE), the experiments are designed with one-half fraction of a 24 design or 24-1 design method for screening experiments. Twenty numbers of experiments are run in production line in the factory. Finally, experiments are designed with central composite design (CCD) to optimal concentration significant factors that obtain from screening experiments. Seventeen numbers of experiments are run in production line in company ‘S’. Total thirty-seven numbers of experiments had been conducted. Software Design Expert is used for simulation and data analysis. ANOVA (analysis of variance) is performed to know interactive effect of the variables on the responses which is to reduce number of defects. It is suggested that the optimal setting of the parameters can reduce number of defects and company can save cost. 2014-11-28T03:13:11Z 2014-11-28T03:13:11Z 2009-05 Learning Object http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912 en Universiti Malaysia Perlis (UniMAP) School of Manufacturing Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Printed circuit board assembly (PCBA)
Manufacturing process
Ball grid array (BGA)
spellingShingle Printed circuit board assembly (PCBA)
Manufacturing process
Ball grid array (BGA)
Tan, Chun Huat
Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
description Access is limited to UniMAP community.
author2 Dr. Muhammad Iqbal Hussain
author_facet Dr. Muhammad Iqbal Hussain
Tan, Chun Huat
format Learning Object
author Tan, Chun Huat
author_sort Tan, Chun Huat
title Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_short Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_full Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_fullStr Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_full_unstemmed Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_sort application of statistical methods to reduce the defect of assembly process for plastic ball grid array (pbga) component
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2014
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
_version_ 1643790746619215872
score 13.214268

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