Dicing die attach film for 3D stacked die QFN packages

• Main Authors: Shahrum, Abdullah, S., Mohd Yusof, Ibrahim, Ahmad, Azman, Jalar, Ruslizam, Daud, Dr.
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: IEEE Conference Publications 2014
• Subjects: Dicing process; Die attach film; Laminating process; SEM; Stacked die
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/35213

Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1