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Dicing die attach film for 3D stacked die QFN packages

Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1

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Bibliographic Details
Main Authors: Shahrum, Abdullah, S., Mohd Yusof, Ibrahim, Ahmad, Azman, Jalar, Ruslizam, Daud, Dr.
Other Authors: shahrum@eng.ukm.my
Format: Working Paper
Language:English
Published: IEEE Conference Publications 2014
Subjects:
Dicing process
Die attach film
Laminating process
SEM
Stacked die
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35213
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Summary:Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1

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