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Dicing die attach film for 3D stacked die QFN packages

Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1

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Bibliographic Details
Main Authors: Shahrum, Abdullah, S., Mohd Yusof, Ibrahim, Ahmad, Azman, Jalar, Ruslizam, Daud, Dr.
Other Authors: shahrum@eng.ukm.my
Format: Working Paper
Language:English
Published: IEEE Conference Publications 2014
Subjects:
Dicing process
Die attach film
Laminating process
SEM
Stacked die
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35213
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spelling my.unimap-352132014-06-09T08:50:09Z Dicing die attach film for 3D stacked die QFN packages Shahrum, Abdullah S., Mohd Yusof Ibrahim, Ahmad Azman, Jalar Ruslizam, Daud, Dr. shahrum@eng.ukm.my azmn@ukm.my ruslizam@unimap.edu.my Dicing process Die attach film Laminating process SEM Stacked die Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1 The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process become greater and die attach paste may not be suitable in most cases. DAF has many advantages including no die tilt, no void, consistent bond line, no bleed out which improves the real estate on the bottom die. This paper reveals the difference of two types of DAF. In dicing die attach film (DDAF) application for QFN stacked die, there are several common responses so the focus will be elucidated the common defect after lamination process and dicing process. Defect like bubble, whisker formation, adhesive merging and flying die are for lamination process. While, chipping at backside, front side and sidewall, and also crack will be inspected for the dicing process. Lamination parameters such as temperature, pressure and speed will be optimized in order to get the best parameter combination for these two types of DAF. In the dicing process the critical parameter such as spindle rotation, saw speed, and blade grit size will be determined based on experimental works. Qualitative analysis will be carried out in order to understand the chipping, crack, adhesive merging and whisker formation. Tools like high power microscope (50x - 500 x magnificent) and SEM will be used to see those defect. The results that show all two types of DAF give the same response at the same parameter setting were presented and thoroughly discussed. 2014-06-09T08:50:09Z 2014-06-09T08:50:09Z 2012 Working Paper p. 73 - 75 978-1-4244-1335-5 http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4417054&tag=1 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35213 http://dx.doi.org/10.1109/IEMT.2007.4417054 en Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 2007; IEEE Conference Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Dicing process
Die attach film
Laminating process
SEM
Stacked die
spellingShingle Dicing process
Die attach film
Laminating process
SEM
Stacked die
Shahrum, Abdullah
S., Mohd Yusof
Ibrahim, Ahmad
Azman, Jalar
Ruslizam, Daud, Dr.
Dicing die attach film for 3D stacked die QFN packages
description Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1
author2 shahrum@eng.ukm.my
author_facet shahrum@eng.ukm.my
Shahrum, Abdullah
S., Mohd Yusof
Ibrahim, Ahmad
Azman, Jalar
Ruslizam, Daud, Dr.
format Working Paper
author Shahrum, Abdullah
S., Mohd Yusof
Ibrahim, Ahmad
Azman, Jalar
Ruslizam, Daud, Dr.
author_sort Shahrum, Abdullah
title Dicing die attach film for 3D stacked die QFN packages
title_short Dicing die attach film for 3D stacked die QFN packages
title_full Dicing die attach film for 3D stacked die QFN packages
title_fullStr Dicing die attach film for 3D stacked die QFN packages
title_full_unstemmed Dicing die attach film for 3D stacked die QFN packages
title_sort dicing die attach film for 3d stacked die qfn packages
publisher IEEE Conference Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35213
_version_ 1643797756237578240
score 13.214268

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