Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous

• Main Authors: Retnasamy, Vithyacharan, Zaliman, Sauli, Dr., Aaron, Koay Terr Yeow, Goh, Siew Chui, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: AENSI Publisher All rights reserved 2014
• Subjects: Contact angle; DOE; Platinum; RIE; Wetability
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/35122

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