Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
Full text of this article is also available at http://mechanical.eng.um.edu.my/
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Main Authors: | Mohd Khairuddin Md Arshad, Uda Hashim, Muzamir Isa |
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Format: | Article |
Language: | English |
Published: |
Department of Mechanical Engineering, University Malaya
2008
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Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/3506 |
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