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Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Full text of this article is also available at http://mechanical.eng.um.edu.my/

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Bibliographic Details
Main Authors: Mohd Khairuddin Md Arshad, Uda Hashim, Muzamir Isa
Format: Article
Language:English
Published: Department of Mechanical Engineering, University Malaya 2008
Subjects:
Flip chip technology
Wafer bumping
Flip chip packaging
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/3506
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spelling my.unimap-35062008-12-23T01:06:49Z Under Bump Metallurgy (UBM)-a technology review for flip chip packaging Mohd Khairuddin Md Arshad Uda Hashim Muzamir Isa Flip chip technology Wafer bumping Flip chip packaging Full text of this article is also available at http://mechanical.eng.um.edu.my/ Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size and lower cost of electronic consumer products. Wafer bumping is unavoidable process in flip chip packaging, thus, picking the correct bumping technology that is capable of bumping silicon wafer at high yield and a high reliability with lower cost is challenging. This paper discusses the available wafer bumping technologies for flip chip packaging. The discussion will be focused on process assembly, solder ball compatibility, design structure and lastly cost which translated to overall product costs. 2008-12-23T01:06:49Z 2008-12-23T01:06:49Z 2007 Article International Journal of Mechanical and Material Engineering, vol. 2 (1), 2007, pages 48-54. http://hdl.handle.net/123456789/3506 http://mechanical.eng.um.edu.my/ en Department of Mechanical Engineering, University Malaya
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Flip chip technology
Wafer bumping
Flip chip packaging
spellingShingle Flip chip technology
Wafer bumping
Flip chip packaging
Mohd Khairuddin Md Arshad
Uda Hashim
Muzamir Isa
Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
description Full text of this article is also available at http://mechanical.eng.um.edu.my/
format Article
author Mohd Khairuddin Md Arshad
Uda Hashim
Muzamir Isa
author_facet Mohd Khairuddin Md Arshad
Uda Hashim
Muzamir Isa
author_sort Mohd Khairuddin Md Arshad
title Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
title_short Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
title_full Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
title_fullStr Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
title_full_unstemmed Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
title_sort under bump metallurgy (ubm)-a technology review for flip chip packaging
publisher Department of Mechanical Engineering, University Malaya
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/3506
_version_ 1643787623476494336
score 13.226497

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