The outcome of sintering parameters study toward the thermal properties of CuSiC composite

• Main Authors: Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir., M.S.J. Hashmi, Dermot, Brabazon
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Coefficient of thermal expansion; Copper; Copper silicon carbide; Electronic chips; Integrated circuit; Metal Matrix Composite (MMC); Packaging materials; Powder metallurgy; Silicon carbide (SiC); Sintering; Thermal conductivity (TC)
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/34467

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