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The outcome of sintering parameters study toward the thermal properties of CuSiC composite

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Main Authors: Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir., M.S.J. Hashmi, Dermot, Brabazon
Other Authors: mzaman@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Coefficient of thermal expansion
Copper
Copper silicon carbide
Electronic chips
Integrated circuit
Metal Matrix Composite (MMC)
Packaging materials
Powder metallurgy
Silicon carbide (SiC)
Sintering
Thermal conductivity (TC)
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34467
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spelling my.unimap-344672014-05-16T07:35:17Z The outcome of sintering parameters study toward the thermal properties of CuSiC composite Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir. M.S.J. Hashmi Dermot, Brabazon mzaman@unimap.edu.my saleem.hashmi@dcu.ie dermot.brabazon@dcu.ie Coefficient of thermal expansion Copper Copper silicon carbide Electronic chips Integrated circuit Metal Matrix Composite (MMC) Packaging materials Powder metallurgy Silicon carbide (SiC) Sintering Thermal conductivity (TC) Link to publisher's homepage at http://www.ttp.net/ Miniaturisation of electronic chips which have increasing functionality within the same package size has induced significant increases in requirements for extraction of heat from the integrated circuit (IC). Packaging materials therefore have to be capable to conduct heat efficiently and at the same time have low coefficient of thermal expansion (CTE) to minimize the thermal stress and warping. In the present study, copper silicon carbide was selected with an aim to solve thermal management problem presented by current IC systems. Powder metallurgy routes were chosen to fabricate the MMC based on this materials system. Copper and silicon carbide powders were mixed together in a planetary ball mill, and the green articles were then compacted and sintered to produce the final product of CuSiC. The sintering parameters were investigated for their effects towards the thermal conductivity of the composite. Sintering parameters investigated included temperature, heating duration and the gaseous environment. Upon sintering, the CuSiC particle bond to one another giving a higher strength and a possibility in attaining desirable density. Thus to achieve good thermal conductivity, the recommended sintering parameter suggests that the CuSiC composite should be sintered at 950°C for 7 hours in nitrogen gas. 2014-05-16T07:35:17Z 2014-05-16T07:35:17Z 2014 Article Key Engineering Materials, vol.594-595, 2014, pages 702-706 1662-9795 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34467 http://www.scientific.net/KEM.594-595.702 10.4028/www.scientific.net/KEM.594-595.702 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Coefficient of thermal expansion
Copper
Copper silicon carbide
Electronic chips
Integrated circuit
Metal Matrix Composite (MMC)
Packaging materials
Powder metallurgy
Silicon carbide (SiC)
Sintering
Thermal conductivity (TC)
spellingShingle Coefficient of thermal expansion
Copper
Copper silicon carbide
Electronic chips
Integrated circuit
Metal Matrix Composite (MMC)
Packaging materials
Powder metallurgy
Silicon carbide (SiC)
Sintering
Thermal conductivity (TC)
Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.
M.S.J. Hashmi
Dermot, Brabazon
The outcome of sintering parameters study toward the thermal properties of CuSiC composite
description Link to publisher's homepage at http://www.ttp.net/
author2 mzaman@unimap.edu.my
author_facet mzaman@unimap.edu.my
Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.
M.S.J. Hashmi
Dermot, Brabazon
format Article
author Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.
M.S.J. Hashmi
Dermot, Brabazon
author_sort Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.
title The outcome of sintering parameters study toward the thermal properties of CuSiC composite
title_short The outcome of sintering parameters study toward the thermal properties of CuSiC composite
title_full The outcome of sintering parameters study toward the thermal properties of CuSiC composite
title_fullStr The outcome of sintering parameters study toward the thermal properties of CuSiC composite
title_full_unstemmed The outcome of sintering parameters study toward the thermal properties of CuSiC composite
title_sort outcome of sintering parameters study toward the thermal properties of cusic composite
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34467
_version_ 1643797496009326592
score 13.214268

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