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Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach

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书目详细资料
Main Authors:	Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Jeevan, Kanesan
其他作者:	knseetharamu@hotmail.com
格式:	Article
语言:	English
出版:	Emerald Group Publishing Limited 2014
主题:	Heat transfer Interpolation Microprocessor chips Temperature distribution
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33934
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