Description: Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach

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Bibliographic Details
Main Authors:	Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Jeevan, Kanesan
Other Authors:	knseetharamu@hotmail.com
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2014
Subjects:	Heat transfer Interpolation Microprocessor chips Temperature distribution
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33934
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Summary:	Link to publisher's homepage at http://www.emeraldinsight.com/