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Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach

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Main Authors: Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Jeevan, Kanesan
Other Authors: knseetharamu@hotmail.com
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
Heat transfer
Interpolation
Microprocessor chips
Temperature distribution
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33934
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spelling my.unimap-339342014-04-23T03:29:54Z Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach Goh, Teck Joo Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Jeevan, Kanesan knseetharamu@hotmail.com gaquadir@unimap.edu.my Heat transfer Interpolation Microprocessor chips Temperature distribution Link to publisher's homepage at http://www.emeraldinsight.com/ This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal design was modeled to simulate a typical thermal design of microprocessor. Key thermal design parameters investigated are the heat source placement distance and level of heat dissipation. Verification of the proposed method was carried out by comparing the results with FEA predictions. Results of the verification show that the proposed method is reasonably accurate for practical purposes. A successful attempt has been made to predict the junction temperature of silicon chip with non-uniform power distribution in a simple way. 2014-04-23T03:29:54Z 2014-04-23T03:29:54Z 2004 Article Microelectronics International, vol. 21(2), 2004, pages 29-35 1356-5362 http://www.emeraldinsight.com/journals.htm?articleid=878475 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33934 http://dx.doi.org/10.1108/13565360410531999 en Emerald Group Publishing Limited
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Heat transfer
Interpolation
Microprocessor chips
Temperature distribution
spellingShingle Heat transfer
Interpolation
Microprocessor chips
Temperature distribution
Goh, Teck Joo
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Jeevan, Kanesan
Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
description Link to publisher's homepage at http://www.emeraldinsight.com/
author2 knseetharamu@hotmail.com
author_facet knseetharamu@hotmail.com
Goh, Teck Joo
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Jeevan, Kanesan
format Article
author Goh, Teck Joo
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Jeevan, Kanesan
author_sort Goh, Teck Joo
title Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
title_short Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
title_full Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
title_fullStr Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
title_full_unstemmed Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
title_sort prediction of temperature in silicon chip with non-uniform power: a lagrangian interpolation approach
publisher Emerald Group Publishing Limited
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33934
_version_ 1643797351234535424
score 13.214268

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