Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application

• Main Author: Chuah Run Yi
• Other Authors: Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
• Format: Learning Object
• Language: English
• Published: Universiti Malaysia Perlis 2008
• Subjects: Milling speed > Testing; Materials engineering; Copper Silicone Carbide > Testing; Composite materials; Copper > Metallurgy
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/3374

Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material to cope thermal problem. Powder metallurgy method is chosen to fabricate Cu...