Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

• Main Authors: Chong, Leong Gan, Classe, Francis, Uda, Hashim, Prof. Dr.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Emerald Group Publishing Limited 2014
• Subjects: Apparent activation energy (Eaa); BGA package; High temperature storage life; Lognormal plot; Long-term reliability; Reliability management; Storage
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33078

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