The thermal expansion behaviors of Cu-SiCp composites

• Main Authors: Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al-Bakri, Abdullah
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Copper matrix composites; Electroless copper; Packaging materials; Porosity; Silicon carbide particles; Thermal expansion
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812

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