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The thermal expansion behaviors of Cu-SiCp composites

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Main Authors: Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al-Bakri, Abdullah
Other Authors: azmikamardin@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Copper matrix composites
Electroless copper
Packaging materials
Porosity
Silicon carbide particles
Thermal expansion
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812
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spelling my.unimap-328122014-03-18T03:23:44Z The thermal expansion behaviors of Cu-SiCp composites Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al-Bakri, Abdullah azmikamardin@unimap.edu.my nazree@unimap.edu.my mustafa_albakri@unimap.edu.my Copper matrix composites Electroless copper Packaging materials Porosity Silicon carbide particles Thermal expansion Link to publisher's homepage at http://www.ttp.net/ The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernel's model which accounts for both the shear and isostatic stresses developed in the component phases 2014-03-18T03:23:44Z 2014-03-18T03:23:44Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 237-240 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.237 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Copper matrix composites
Electroless copper
Packaging materials
Porosity
Silicon carbide particles
Thermal expansion
spellingShingle Copper matrix composites
Electroless copper
Packaging materials
Porosity
Silicon carbide particles
Thermal expansion
Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al-Bakri, Abdullah
The thermal expansion behaviors of Cu-SiCp composites
description Link to publisher's homepage at http://www.ttp.net/
author2 azmikamardin@unimap.edu.my
author_facet azmikamardin@unimap.edu.my
Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al-Bakri, Abdullah
format Article
author Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al-Bakri, Abdullah
author_sort Azmi, Kamardin
title The thermal expansion behaviors of Cu-SiCp composites
title_short The thermal expansion behaviors of Cu-SiCp composites
title_full The thermal expansion behaviors of Cu-SiCp composites
title_fullStr The thermal expansion behaviors of Cu-SiCp composites
title_full_unstemmed The thermal expansion behaviors of Cu-SiCp composites
title_sort thermal expansion behaviors of cu-sicp composites
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812
_version_ 1643796994566651904
score 13.209306

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