The thermal expansion behaviors of Cu-SiCp composites
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2014
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my.unimap-328122014-03-18T03:23:44Z The thermal expansion behaviors of Cu-SiCp composites Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al-Bakri, Abdullah azmikamardin@unimap.edu.my nazree@unimap.edu.my mustafa_albakri@unimap.edu.my Copper matrix composites Electroless copper Packaging materials Porosity Silicon carbide particles Thermal expansion Link to publisher's homepage at http://www.ttp.net/ The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernel's model which accounts for both the shear and isostatic stresses developed in the component phases 2014-03-18T03:23:44Z 2014-03-18T03:23:44Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 237-240 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.237 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812 en Trans Tech Publications |
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Copper matrix composites Electroless copper Packaging materials Porosity Silicon carbide particles Thermal expansion |
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Copper matrix composites Electroless copper Packaging materials Porosity Silicon carbide particles Thermal expansion Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al-Bakri, Abdullah The thermal expansion behaviors of Cu-SiCp composites |
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azmikamardin@unimap.edu.my |
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azmikamardin@unimap.edu.my Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al-Bakri, Abdullah |
format |
Article |
author |
Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al-Bakri, Abdullah |
author_sort |
Azmi, Kamardin |
title |
The thermal expansion behaviors of Cu-SiCp composites |
title_short |
The thermal expansion behaviors of Cu-SiCp composites |
title_full |
The thermal expansion behaviors of Cu-SiCp composites |
title_fullStr |
The thermal expansion behaviors of Cu-SiCp composites |
title_full_unstemmed |
The thermal expansion behaviors of Cu-SiCp composites |
title_sort |
thermal expansion behaviors of cu-sicp composites |
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Trans Tech Publications |
publishDate |
2014 |
url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812 |
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1643796994566651904 |
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13.222552 |