Comments: Wire bond shear test simulation on hemispherical surface bond pad

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Bibliographic Details
Main Authors:	Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Wan Mokhzani, Wan Norhaimi, Johari, Adnan, Assc. Prof. Dr., Palianysamy, Moganraj
Other Authors:	W.M.W. Norhaimi, J. Adnan, M. Palianysamy
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	ANSYS Hemisphere surface bond pad Shear test Wire bond
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/32646
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