Wire bond shear test simulation on hemispherical surface bond pad
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Trans Tech Publications
2014
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my.unimap-326462014-03-13T03:35:46Z Wire bond shear test simulation on hemispherical surface bond pad Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Wan Mokhzani, Wan Norhaimi Johari, Adnan, Assc. Prof. Dr. Palianysamy, Moganraj W.M.W. Norhaimi, J. Adnan, M. Palianysamy vc.sundress@gmail.com ANSYS Hemisphere surface bond pad Shear test Wire bond Link to publisher's homepage at http://www.ttp.net/ Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this study, simulation on wire bond shear test is done to evaluate the stress response of the bonded wire when sheared on a hemispherical surface bond pad. The contrast between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were carry out to examine the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response. 2014-03-13T03:32:11Z 2014-03-13T03:32:11Z 2012-12 Article Advanced Materials Research, vol.262-623, 2012, pages 643-646 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32646 http://www.scientific.net/AMR.622-623.643 en Trans Tech Publications |
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Malaysia |
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Universiti Malaysia Perlis |
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http://dspace.unimap.edu.my/ |
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English |
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ANSYS Hemisphere surface bond pad Shear test Wire bond |
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ANSYS Hemisphere surface bond pad Shear test Wire bond Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Wan Mokhzani, Wan Norhaimi Johari, Adnan, Assc. Prof. Dr. Palianysamy, Moganraj Wire bond shear test simulation on hemispherical surface bond pad |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
W.M.W. Norhaimi, J. Adnan, M. Palianysamy |
| author_facet |
W.M.W. Norhaimi, J. Adnan, M. Palianysamy Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Wan Mokhzani, Wan Norhaimi Johari, Adnan, Assc. Prof. Dr. Palianysamy, Moganraj |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Wan Mokhzani, Wan Norhaimi Johari, Adnan, Assc. Prof. Dr. Palianysamy, Moganraj |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Wire bond shear test simulation on hemispherical surface bond pad |
| title_short |
Wire bond shear test simulation on hemispherical surface bond pad |
| title_full |
Wire bond shear test simulation on hemispherical surface bond pad |
| title_fullStr |
Wire bond shear test simulation on hemispherical surface bond pad |
| title_full_unstemmed |
Wire bond shear test simulation on hemispherical surface bond pad |
| title_sort |
wire bond shear test simulation on hemispherical surface bond pad |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/32646 |
| _version_ |
1643796940536676352 |
| score |
13.222552 |