Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

• Main Authors: Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: Scientific.Net 2013
• 主题: Lead-Free Solder; Powder Metallurgy; Sn-Ag-Cu; Materials engineering
• 在线阅读: http://dspace.unimap.edu.my/xmlui/handle/123456789/25577

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