Description: Temperature cycling analysis for ball grid array package using finite element analysis

Link to publisher's homepage http://www.emeraldinsight.com/

Saved in:

Bibliographic Details
Main Authors:	Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2011
Subjects:	Finite element analysis Joining processes Soldering Stress (materials) Surface fitting
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/12182
Tags:	Add Tag No Tags, Be the first to tag this record!

Description
Summary:	Link to publisher's homepage http://www.emeraldinsight.com/