Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
Doping lead-free solders with minor additions of alloying and impurity elements such as Ni, Bi or Zn appears to have major effects on the growth of intermetallics (IMC) in solder joints during reflow soldering between the Sn-AgCu lead-free solders and the surface finish metallurgy. In this pape...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/6670/1/IEMT2012-P131.pdf http://umpir.ump.edu.my/id/eprint/6670/ http://dx.doi.org/10.1109/IEMT.2012.6521825 |
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| Summary: | Doping lead-free solders with minor additions of
alloying and impurity elements such as Ni, Bi or Zn appears
to have major effects on the growth of intermetallics (IMC)
in solder joints during reflow soldering between the Sn-AgCu
lead-free solders and the surface finish metallurgy. In
this paper, the results of the effect of small Nickel additions (0.05 and 0.1 wt%) on intermetallic formation during soldering with Sn-3Ag-0.5Cu (SAC305) are presented. The Ø500µm solder alloys of Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu0.05Ni
and Sn-3Ag-0.5Cu-0.1Ni were investigated in detail
after reflow soldering at 250oC on copper finish and
isothermally aged at 150oC for up to 2000 hours. The results
show that after reflow soldering, scallop-type Cu6Sn5/ (Cu,
Ni)6Sn5 was the only reaction product formed. A strong
influence of Ni addition on the growth rate and thickness of
the Cu3Sn layer was also observed. Addition of as little as
0.05wt% Ni to SAC305 solder effectively slows down the
growth of this Cu3Sn phase while growth of the Cu6Sn5
continued to increase with increasing in aging time.
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