Role of crystallographic orientation of β-sn grain on electromigration failures in lead-free solder joint: An overview

• Main Authors: Bashir, Muhammad Nasir, Butt, Sajid Ullah, Mansoor, Muhammad Adil, Khan, Niaz Bahadur, Bashir, Shahid, Wong, Yew Hoong, Alamro, Turki, Eldin, Sayed Mohamed, Jameel, Mohammed
• Format: Article
• Published: MDPI 2022
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/46193/; https://doi.org/10.3390/coatings12111752

Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the beta-Sn grain plays an important role in electromigration failures. Several studies have been carried out to investigate the effect of Sn...