Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux
The electromigration (EM) degrades the structural, mechanical and electrical properties of solder joints. An effort has been made to investigate the effects of the Ni nanoparticles (NP) doped flux on the mechanical properties and electrical resistance of SAC305 solder joints subjected to EM. SAC305...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
Springer
2018
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/22343/ https://doi.org/10.1007/s10854-017-8252-0 |
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