Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration
In Sn-based solder joints, the size of interfacial IMC grains plays an important role in determining the properties of solder joints. An effort has been made to investigate the effects of Ni and Co nanoparticles (NP)-doped flux on the grain size of interfacial intermetallic compound (IMC) in SAC305...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
Springer
2022
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/42155/ |
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