Effects of concentration of adipic acid on the electrochemical migration of tin for printed circuit board assembly

• Main Authors: Goh, Yi Sing, Haseeb, A. S. M. A., Basirun, Wan Jeffrey, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, Boon Yew
• Format: Article
• Published: Springer 2023
• Subjects: QD Chemistry; TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/38834/

The continuous advancement in innovative electronic applications leads to closer interconnection spacing and higher electric field density, thus increasing the risk of electrochemical migration (ECM)-related failures. The ECM of tin (Sn) attracts great interest due to the wide use of Sn on the surfa...