In-situ study of electrochemical migration of tin in the presence of bromide ion
The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates th...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Nature Research
2021
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/28293/ |
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