Effects of concentration of adipic acid on the electrochemical migration of tin for printed circuit board assembly
The continuous advancement in innovative electronic applications leads to closer interconnection spacing and higher electric field density, thus increasing the risk of electrochemical migration (ECM)-related failures. The ECM of tin (Sn) attracts great interest due to the wide use of Sn on the surfa...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Springer
2023
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/38834/ |
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