Stitch bond strength study in insulated Cu wire bonding

• Main Authors: Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.
• Format: Article
• Published: Maney Publishing 2014
• Subjects: Q Science (General)
• Online Access: http://eprints.um.edu.my/15471/

The market demands for higher pin counts and more chips functionality pose challenges in conventional wire bonding. However, insulated Cu wire technology enables fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper presents the...