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Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models

The mechanics of failure in a solder joint under cyclic mechanical loading is quantified and described in this paper. It is postulated that fatigue failure of the solder joint occurs through simultaneous competitive mechanisms of cyclic damage processes occurring through the bulk solder and across s...

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書誌詳細
主要な著者:	Shaffiar, Norhashimah, Yamin, A.F.M., Loh, W.K., Tamin, M.N.
フォーマット:	Conference or Workshop Item
言語:	English
出版事項:	2012
主題:	T Technology (General)
オンライン･アクセス:	http://irep.iium.edu.my/39062/1/EPTC__2012.pdf http://irep.iium.edu.my/39062/
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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