Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging

• Main Authors: Zulkifli M.N., Abdullah I., Azhan N.H., Jalar A.
• Other Authors: 36703431600
• Format: Article
• Published: Taylor and Francis Ltd. 2025
• Subjects: Binary alloys; Copper alloys; Creep; Grain boundaries; Hardness; Isotherms; Lead alloys; Lead-free solders; Microstructure; Open source software; Particle size analysis; Scanning electron microscopy; Silver alloys; Ternary alloys; Tin alloys; Imagej; Isothermal ageing; Micro-mechanical; Mixed solder joint; Nano indentation; Phase grains; Phase particles; Rich phase; Solder joints; Stress exponents; Nanoindentation

This paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnP...