Role of alternating current shape on microstructure and damage evolution of solder joints

• المؤلفون الرئيسيون: Siswanto W.A., Krasnopevtsev A.Y., Talarpoushti G.F., Maseleno A., Kuzichkin O.R.
• مؤلفون آخرون: 42862458800
• التنسيق: مقال
• منشور في: Elsevier Ltd 2023

Degradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurement