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Focused ion beam machining of silicon

This paper optimizes the parameters of a focused gallium ion beam system for the micromachining of single-crystal silicon. The effect of the parameters on the surface integrity and material removal rate (MRR) were studied. The surface integrity and machined features were measured with a scanning pro...

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Main Authors: Hung, NguyenPhu, Fu, Yongqi, Ali, Mohammad Yeakub
Format: Article
Language:English
Published: Elsevier BV 2002
Subjects:
TS Manufactures
Online Access:http://irep.iium.edu.my/27110/1/022_JMPT_127%282%29_256-260.pdf
http://irep.iium.edu.my/27110/
http://www.sciencedirect.com/science/article/pii/S092401360200153X
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spelling my.iium.irep.271102013-07-23T07:22:34Z http://irep.iium.edu.my/27110/ Focused ion beam machining of silicon Hung, NguyenPhu Fu, Yongqi Ali, Mohammad Yeakub TS Manufactures This paper optimizes the parameters of a focused gallium ion beam system for the micromachining of single-crystal silicon. The effect of the parameters on the surface integrity and material removal rate (MRR) were studied. The surface integrity and machined features were measured with a scanning probe microscope. Statistical models were established to predict the sputtered depths and MRRs. The sputtering depth increased with higher accelerating voltage, more ion dose, shorter pixel spacing, and longer dwell time. Similar trends were found for predicting the MRR. A surface roughness in the range of 2-5 nm was achieved, and was found to be linearly dependent on the pixel spacing. © 2002 Elsevier Science B.V. All rights reserved. Elsevier BV 2002 Article REM application/pdf en http://irep.iium.edu.my/27110/1/022_JMPT_127%282%29_256-260.pdf Hung, NguyenPhu and Fu, Yongqi and Ali, Mohammad Yeakub (2002) Focused ion beam machining of silicon. Journal of Materials Processing Technology, 127 (2). pp. 256-260. ISSN 0924-0136 http://www.sciencedirect.com/science/article/pii/S092401360200153X 10.1016/S0924-0136(02)00153-X
institution Universiti Islam Antarabangsa Malaysia
building IIUM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider International Islamic University Malaysia
content_source IIUM Repository (IREP)
url_provider http://irep.iium.edu.my/
language English
topic TS Manufactures
spellingShingle TS Manufactures
Hung, NguyenPhu
Fu, Yongqi
Ali, Mohammad Yeakub
Focused ion beam machining of silicon
description This paper optimizes the parameters of a focused gallium ion beam system for the micromachining of single-crystal silicon. The effect of the parameters on the surface integrity and material removal rate (MRR) were studied. The surface integrity and machined features were measured with a scanning probe microscope. Statistical models were established to predict the sputtered depths and MRRs. The sputtering depth increased with higher accelerating voltage, more ion dose, shorter pixel spacing, and longer dwell time. Similar trends were found for predicting the MRR. A surface roughness in the range of 2-5 nm was achieved, and was found to be linearly dependent on the pixel spacing. © 2002 Elsevier Science B.V. All rights reserved.
format Article
author Hung, NguyenPhu
Fu, Yongqi
Ali, Mohammad Yeakub
author_facet Hung, NguyenPhu
Fu, Yongqi
Ali, Mohammad Yeakub
author_sort Hung, NguyenPhu
title Focused ion beam machining of silicon
title_short Focused ion beam machining of silicon
title_full Focused ion beam machining of silicon
title_fullStr Focused ion beam machining of silicon
title_full_unstemmed Focused ion beam machining of silicon
title_sort focused ion beam machining of silicon
publisher Elsevier BV
publishDate 2002
url http://irep.iium.edu.my/27110/1/022_JMPT_127%282%29_256-260.pdf
http://irep.iium.edu.my/27110/
http://www.sciencedirect.com/science/article/pii/S092401360200153X
_version_ 1643609271290560512
score 13.209306

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